YUANNENGJI (1) Ana rong jinis lem patch LED
1. Tipe Dispensing: lim ditrapake ing papan sirkuit sing dicithak liwat peralatan dispensing.
2. Tipe scraping: lim wis Applied liwat bolong baja utawa printing bolong tembaga lan scraping.
(2) adhesive lumahing tembelan LED (SMA, lumahing Gunung adhesives) digunakake kanggo soldering gelombang lan reflow soldering. Utamane digunakake kanggo ndandani komponen ing papan sirkuit sing dicithak. Umume disebarake kanthi dispensing utawa percetakan bolong baja kanggo njaga posisi komponen ing papan sirkuit sing dicithak (PCB) kanggo mesthekake yen komponen ora bakal ilang nalika proses transmisi ing baris Déwan. Sawise komponen ditempelake, lagi diselehake ing open utawa reflow mesin soldering kanggo dadi panas lan hardening. Beda karo pasta solder sing diarani. Sawise digawe panas lan hardened, ora bakal lebur maneh. Ing tembung liyane, proses hardening termal saka lim patch ora bisa dibalèkaké. Efek saka lim tembelan SMT bakal beda-beda gumantung saka kondisi perawatan termal, obyek sing arep disambungake, piranti sing digunakake, lan lingkungan operasi. Nalika nggunakake, lim patch kudu dipilih miturut proses produksi.
(3) LED SMD Kab adhesive Paling lumahing Gunung adhesives (SMA) iku epoxies, sanajan akrilik digunakake kanggo tujuan khusus. Sawise introduksi sistem dispensing lem kacepetan dhuwur lan industri elektronik nguwasani cara ngatasi produk kanthi umur rak sing cendhak., resin epoksi wis dadi teknologi adesif sing luwih utama ing saindenging jagad. Resin epoksi umume nyedhiyakake adhesi sing apik kanggo macem-macem papan sirkuit lan nduweni sifat listrik sing apik banget. Bahan utama yaiku: bahan dhasar (i.e. bahan polimer utama), pangisi, agen curing, aditif liyane, lsp.
(4) Tujuan nggunakake adhesive SMD LED
1. Nyegah komponen saka tiba mati nalika gelombang soldering (proses solder gelombang)
2. Nyegah komponen saka tiba mati ing sisih liyane sak reflow soldering (proses solder reflow kaping pindho)
3. Nyegah komponen saka owah-owahan lan ngadeg (proses solder reflow, proses pre-coating)
4. menehi tandha (gelombang solder, reflow solder, pra-lapisan). Nalika Papan dicithak lan komponen diganti ing kumpulan, SMD adhesive digunakake kanggo menehi tandha.
(5) Cara dispensing lem LED SMA bisa ditrapake ing PCB nggunakake dispensing lem syringe, transfer jarum utawa printing cithakan. Cara transfer jarum digunakake ing kurang saka 10% saka kabeh aplikasi. Iki nggunakake macem-macem jarum sing dicelupake ing nampan lem. The suspended glue droplets are then transferred to the board as a whole. These systems require a lower viscosity glue and good resistance to moisture absorption because it is exposed to the indoor environment. The key factors controlling needle transfer glue dispensing include needle diameter and style, glue temperature, needle immersion depth and glue dispensing cycle length (including delay time before and during needle contact with PCB). The tank temperature should be between 25~30°C, which controls the viscosity of the glue and the number and form of glue dots. Temperature will affect viscosity and glue dot shape. Most glue dispensers rely on temperature control devices on the needle nozzle or in the chamber to keep the glue temperature above room temperature. Nanging, yen suhu PCB tambah saka proses sadurunge, profil titik lem bisa rusak.